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Product
4-Channel 200 MHz A/D with DDC, Virtex-7 FPGA - XMC
Model 71761
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe- Four 200 MHz 16-bit A/Ds- Four multiband DDCs (digital downconverters)- Multiboard programmable beamformer- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Test Fixture Kits
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Our test fixture kits provide cost effective solutions to printed circuit board testing and other devices under test. Our modular kits are available in multiple sizes and configurations. They can easily be customized if our standard doesn’t meet your requirements. Removable side panels for ease of fabrication for I/O connections, switches or other hardware.
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Product
6U VPX Power Backplanes
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VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Product
Flat-plate Thermal Conductivity Tester
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TESTEX Testing Equipment Systems Ltd.
Flat-plate Thermal Conductivity Tester, to determine the thermal conductivity of various fabrics, quilting products, and other heat insulation materials.
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Product
Ceramic Process Carrier Pallets
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Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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Product
Bean Bag Snag Tester
TF221
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TESTEX Testing Equipment Systems Ltd.
Bean Bag Snag Tester, to determine the snagging and picking resistance of knitted and woven fabrics by tumbling fabrics pillows containing a weighted bean bag within two separate test cylinders.
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Product
Chassis 8 Slot
PXIe 4U/ 42HP
Chassis
As PXI has evolved into high-speed serial fabric technology, so has the Hartmann Electronic product line with the addition of its PXIe solutions. More power, more bandwidth, more functionality.
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Product
Schildknecht Flexing Tester
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TESTEX Testing Equipment Systems Ltd.
Schildknecht Flexing Tester is designed to determine the resistance of coated fabrics to damage by flexing due to oscillation at 500 times per minute. Schildknecht Flexing Tester complies with ISO 7854, BS 3424, etc.
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Product
Rugged Blade Processor W/ Dual Xeon E5
ATC126
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The ATC126 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with up to eight banks of 256 GB DDR4 memory with ECC. Versatile connectivity includes two 10/40GbE Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector.
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Product
Propeller Meters
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Measures accurately over a flow range of 10:1 or greater.± 2% of rate accuracy, guaranteed by certified wet calibration at three test points in.Sparling’s National Institute of Standards and Technology (NIST) traceable hydraulic flow lab.Sturdy cast or fabricated steel construction.Operating temperatures are over 100° F(unless higher temperature construction is specified).Suspended solids are over 0.5% of volume.Easily maintained with standard tools.Registration can be furnished in any standard Engineering Unit.
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Product
Instruments
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Advanced Thermal Solutions, Inc.
ATS designs and fabricates the most extensive line of thermal test instruments specifically designed for the electronics industry. These research-quality, state-of-the-art instruments include Pressure, Temperature and Velocity Measurement Systems, Airflow and Heat Flux Controllers, Micron-level Thermography Systems and Cold-Plate Thermal Characterization Systems.
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Product
Motorized Force Test System
MT Series
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In the past, film extruders, paper producers, converters, and woven/non-woven fabric producers have had the choice of test stands and universal test machines which are either value-priced peak-force-only machines, or expensive computer-operated integral-load cell machines. Now you can have the best of both worlds in a single instrument. The series MT-1500, a simple to use computer operated tester, with Quality Control software for automatic calculation and graphical display of break, elongation, yield, modulus, and other, tension and compression force information.
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Product
NVMe-oF
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NVMe/oF adoption is rapidly increasing and full NVMe specification conformance over Ethernet networks or Fibre Channel fabrics requires the ability to validate transactions over all transports.
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Product
Circular Locus Tester
TF225
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TESTEX Testing Equipment Systems Ltd.
Circular Locus Tester, to determine surface deterioration and quality of fabrics (wool, chemical fiber, mixed, kitted and woven fabrics). Circular Locus Tester complies with GB/T 4802.1-2008, etc.
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Product
Textile Testing Equipment
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Manufacture and supply a wide range of textile testing equipments. Our machines all meet with: ISO, ASTM, AATCC, BS, EN, DIN, JIS and other requireable standards. Yarn, Fiber and fabric testers. Strength, Abrasion, pilling, flammability fatigue, peeling, appearance, etc. testing.
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Product
Brush or Sponge Pilling Tester
TF222
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TESTEX Testing Equipment Systems Ltd.
Brush or Sponge Pilling Tester, to determine the pilling propensity and simulate normal wear of knitted and woven fabrics used in apparel and automotive interiors by brush and/or sponging specimens together in a circular motion to form pills. Specimens are evaluated under standard lighting conditions using a pilliscope, light cabinet or similar, against users’ standard fabrics or piling photographs.
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Product
Multi-purpose Textile Flammability Tester
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TESTEX Testing Equipment Systems Ltd.
Multi-purpose Textile Flammability Tester, to determine the flammability resistance of textile fabrics and for the flammability test of toys and toy material. Multi-purpose Textile Flammability Tester complies with ISO 6940 (1995&2004) / 6941 (1995&2003), ISO 15025, EN71-2, etc. Please contact us for more information about flammability test method.
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Product
Switch & Router Modules
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Curtiss-Wright Defense Solutions
Our highly engineered networking cards provide systems integrators with a fast and powerful way to interconnect chassis, cards, and CPUs through switched Gigabit, 10 Gigabit, and 40 Gigabit Ethernet. Operating at wire-speed, Ethernet switching and routing can be used to architect the infrastructure for unified (Ethernet only) or hybrid (Ethernet control and other switched data-plane fabric) networks for transferring IP-based control and data packets within advanced military systems.
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Product
Calibration Services
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For over 25 years, OAI (Optical Associate Inc.), is the leader in NIST traceable calibration of instruments for measuring Ultra Violet (UV) light. Originally designed to meet the demanding needs of the semiconductor wafer fabrication industry, OAI developed the most repeatable NIST traceable calibration in the industry.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
20 x GB ETH Switch
SL4-TUBA
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SL4-TUBA is a peripheral slot card for CompactPCI® Serial systems. The board is equipped with a modular Gigabit Ethernet switch fabric up to 20 ports.
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Product
Monolithic Laser Combiners & Precision Optics
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For more than 40 years, our vertically integrated in-house production teams have relied on collaborative interdisciplinary processes to drive product performance and manufacturability. And we back up everything we do with industry-leading metrology to ensure that the building blocks of our technology – fabrication, coating, and assembly – permanently align to your exacting specifications to deliver consistent, shipment-to-shipment product performance, even in the most demanding environments.
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Product
Multi-purpose Textile Flammability Tester
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TESTEX Testing Equipment Systems Ltd.
Multi-purpose Textile Flammability Tester, to determine the flammability resistance of textile fabrics and for the flammability test of toys and toy material. Multi-purpose Textile Flammability Tester complies with ISO 6940 (1995&2004) / 6941 (1995&2003), ISO 15025, EN71-2, etc. Please contact us for more information about flammability test method.
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Product
Process EDXRF Spectrometer
NEX LS
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Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
IDA Electrodes
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Interdigitated Array (IDA) electrode is an electrode developed for electrochemical measurements to be performed in a very small quantity of the sample. IDA electrode could be applied for the detection and reaction analysis of the compounds in a small quantity of the sample. IDA electrode is a microelectrode pattern fabricated by using the lithography technology. The Electrodes are composed of 65 pairs. In each one of the pair has a function of the oxidation and reduction electrodes.
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Product
4-Channel 200 MHz A/D with 32-Channel DDC, Virtex-7 FPGA - XMC
Model 71762
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- Four 200 MHz 16-bit A/Ds- Four multiband DDCs- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable serial gigabit interfaces- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Also available in 3U VPX, 3U & 6U cPCI & PCIe- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe- See comparable Jade Xilinx Kintex UltraScale FPGA Module: Model 71862
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Product
Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Product
For Conduction Cooled ΜTCA Chassis
UTC003
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The VadaTech UTC003 is the most feature-rich MCH (MicroTCA Carrier Hub) for the Conduction Cooled μTCA chassis in the market. It’s management software is based on VadaTech’s proven Carrier Manager and Shelf Manager. The MCMC manages the power modules, the two CU (Cooling Units) and up to 12 AMCs within the μTCA chassis. It also interfaces to and manages the on-board fabric interfaces. The module is available with PCIe, SRIO, 10GbE Layer 3 managed, and GbE Layer 2 managed. The UTC003 runs Linux 2.6 on it’s MCMC CPU and is hot-swappable and fully redundant when used in conjunction with a second instance of the module. The firmware is HPM.1 compliant which allows for ease of upgrade. The UTC003 provides Fabric (100 Mhz HCSL) clock to each AMC.
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Product
Thermal Control Devices
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Sumitomo Electric Industries, Ltd.
Sumitomo Electric offers heat control devices with excellent heat characteristics by combining its proprietary high-functional material technologies with process technologies (e.g. metallization, joining, sealing) and heat design technologies. These technologies are applied in the heaters for semiconductor fabrication equipment that achieves superior temperature uniformity and rapid heating and cooling characteristics.
