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Wyzenbeek Abrasion Tester
TESTEX Testing Equipment Systems Ltd.
Wyzenbeek Abrasion Tester，to determine the abrasion resistance of fabrics when rubbed against a standard abradent or a wire mesh screen with a backward and forward motion over a curved surface. Wyzenbeek Machine complies with ASTM D4157, etc. Please contact us for more information about Wyzenbeek methods.
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Fabric Unidirectional Water Transmission Performance Tester
DRK-UPT1
Shandong Drick Instruments Co., Ltd.
The unidirectional water transmission performance tester is a special instrument for measuring the unidirectional water transmission performance of textiles.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Sensor
Lepton
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Monolithic Laser Combiners & Precision Optics
For more than 40 years, our vertically integrated in-house production teams have relied on collaborative interdisciplinary processes to drive product performance and manufacturability. And we back up everything we do with industry-leading metrology to ensure that the building blocks of our technology – fabrication, coating, and assembly – permanently align to your exacting specifications to deliver consistent, shipment-to-shipment product performance, even in the most demanding environments.
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Wet Oxidation System For VCSEL Fabrication
VIXEL-320
The VIXEL-320 is a wet oxidation system intended for the fabrication of Vertical Cavity Surface Emitting Lasers. It is an atmospheric-pressure oxidation system with in-situ monitoring of oxide aperture formation. It accommodates single wafers of up to 150mm (6") in diameter.
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EEE Component Testing and Screening Services
DPACI performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability commercial, industrial, space, and U.S. military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications. Our engineering experience in electronic parts screening, qualification, and in-house test fixture fabrication allows us to provide value added components in a timely manner.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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High-Speed Switching Diodes 33 To 140 GHz
Insight Product Company offers high-speed switching diodes with switching time up to 2 nsec and operating frequency range up to 140 GHz. Silicon p+-p-n-n+ high-speed switching diodes are designed to be used in mm-wave switching devices, phase changers, modulators, attenuators for the millimeter wavelength range. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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45 Degree Flammability Tester
TESTEX Testing Equipment Systems Ltd.
45 Degree Flammability Tester, to determine fabric flammability under controlled conditions total automatically(fabric burn test). 45 Degree Flammability Tester complies with ASTM D1230, CALIF TB117, FTMS191-5908, etc. Our product is the best choice for you when you do flammability test for fabric in flammability testing labs.
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Power Couplers
Communications & Power Industries
CPI BMD has extensive experience working with the world’s best accelerator scientists and engineers to fabricate power couplers for superconducting accelerators. - Used in superconducting accelerators- Found in free electron lasers- Found in Spallation neutron sources- Used in energy recovery LINACs- Used in Third harmonic cavities
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0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Surface Water Absorption Tester
TF167
TESTEX Testing Equipment Systems Ltd.
Specimens are placed at an angle on the base of the apparatus. After water flows down the surface of each specimen, the amount of water retained by each specimen is measured. Six specimens are tested, three on the face of the fabric and three on the back of the fabric. The six observations are averaged to determine the surface water absorption of the fabric.
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NFPA 701-1 Flammability Tester
TF320
TESTEX Testing Equipment Systems Ltd.
NFPA 701-1 Flammability Tester, to determine the ignition resistance properties of draperies and other hanging fabrics according to test method NFPA 701#1, and it is suitable for single-layer or multi-layer fabrics, but not suitable for fabrics with density larger than 700g/m2 (21oz/yd2).
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1 GHz A/D and D/A with Virtex-6 FPGA - 3U VPX
Model 52630
- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- One GHz 12-bit A/D- One GHz 16-bit D/A- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Solid State Digital Matrix Switching Systems
DX Series
Cytec's DX Series Switching Systems are based on solid state switch fabric. All systems are non-blocking (any input to any output) and full fan-out (any input to any or all outputs)
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Water Vapour Permeability Tester
TF165
TESTEX Testing Equipment Systems Ltd.
Water Vapour Permeability Tester, to determine the resistance of textiles and textile composites (particularly action wear fabrics) to water vapour penetration. Water vapour permeability tester consists of 8 containers with water reservoirs; a standard permeable fabric cover, sample holder ring and precision drive system.
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Powered VXS Crates
6U VXS 6023-JL
The WIENER VXS 6023 crate series adds high performance Switch Fabrics according to VITA 41 specification to VME based systems. Designed primarily for high speed applications in data acquisition, as well as military / aerospace test and instrumentation it combines superior mechanical quality with lowest noise power supply technology.
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Automated Monitoring of Airborne Molecular Contamination
AMC-Monitor T-1000
The all-in-one analyzer for FOUP, fab and clean-room environment AMC monitoring in the semiconductor industry. The AMC-Monitor is a modular and flexible platform for airborne molecular contaminations (AMC) monitoring in semiconductor applications such as: FOUP analysis with a focus on VOC and condensables incl. full integration with Pfeiffer Vacuum APA 302 pod analyzer. Clean-room monitoring in fabrication plants.
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For Conduction Cooled ΜTCA Chassis
UTC003
The VadaTech UTC003 is the most feature-rich MCH (MicroTCA Carrier Hub) for the Conduction Cooled μTCA chassis in the market. It’s management software is based on VadaTech’s proven Carrier Manager and Shelf Manager. The MCMC manages the power modules, the two CU (Cooling Units) and up to 12 AMCs within the μTCA chassis. It also interfaces to and manages the on-board fabric interfaces. The module is available with PCIe, SRIO, 10GbE Layer 3 managed, and GbE Layer 2 managed. The UTC003 runs Linux 2.6 on it’s MCMC CPU and is hot-swappable and fully redundant when used in conjunction with a second instance of the module. The firmware is HPM.1 compliant which allows for ease of upgrade. The UTC003 provides Fabric (100 Mhz HCSL) clock to each AMC.
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Two Port Fibre Channel/MIL-STD-1760E Network Interface Controller
cPCI-HS1760-NCSW-2
Avionics Interface Technologies
Integration of Up Fibre Channel and Down Fibre Channel interfaces - Embedded Network Controller (NC) with four priority levels - Two F/AE ports for communication to external devicesInternal four port non‐blocking fabric switch for communication between NC and external devices - Four port non‐blocking Fibre Channel Switch - Meets the requirements of MIL‐STD‐1760E and AS5653 standards - Initialize via the Fast Fabric Initialization (FFI) protocol - ANSI C API enabling complete FC-AE-1553 NC functionality and management - 3U Conduction-cooled Compact PCI module - Designed for extended temperature operations
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Gen-Z
Gen-Z is a data-access technology designed to provide high-speed, low-latency, memory-semantic access to data and devices via direct-attached, switched or fabric topologies. Gen-Z components use low-latency read and write operations to directly access data and use a variety of advanced operations to move data with minimal application or processor involvement. Gen-Z fabric utilizes memory-semantic communications to move data between memories on different components with minimal overhead. Memory-semantic communications are extremely efficient and simple, which is critical to delivering optimal performance and power consumption. Teledyne LeCroy provides protocol analysis and error injection test equipment to support development and debug of Gen-Z based devices
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Multi-Fabric Switch
PEX431
Designed to enable the development of complex, scalable, high performance 3U VPX systems in today’s increasingly-connected military/aerospace world, the PEX431 is characterized by significant flexibility. The PEX431 Multi-Fabric Switch and XMC Carrier Card allow designers to build complex VPX systems with multiple single board computers and multiple I/O modules. PEX431 supports PCIe switching, GigE switching and the ability to host a XMC mezzanine.
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Textile Tensile Testing Machine
TF002
TESTEX Testing Equipment Systems Ltd.
Textile Tensile Testing Machine, to determine the physical and mechanical performance of tension, tearing, compression, bursting, rapture, flexibility, shear and peel and seam slippage. Especially designed to test a wide range of yarn, fabric, leather, with a huge assortment of specimen grips and software available, it can also be used for strength test of rubber, plastic, metal, wire, paper, packaging, and other materials
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Chambers and Glove Boxes
Standard Environments: ETS' multi-purpose benchtop units for laboratory and production use are large enough to accommodate testing and fabrication, as well as storage of materials, test equipment, and assemblies, yet they are small enough to fit on a standard workbench. The systems are able to independently maintain humidity from <5% to >95% RH and temperature from -22F to 122F (-35 to 50C) when unit is placed in an ambient environment location.
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Micro Vickers Hardness Tester
Sinowon Innovation Metrology Manufacture Ltd.
◆ MicVision main use in testing materials allows for the measurement of the hardness of small or thin specimens and small areas of larger specimens, MicVision testing is commonly used to determine characteristics of thin sheets, foils, fine wire, epoxies, paints, etc. and is often employed in R&D applications .◆ MicrVision hardness is especially useful in determining hardness variations, caused by hardening, quenching, plating, fabrication, welding or annealing, bonding, etc. Micro hardness testing can be accurately employed using loads as slight as 10 gram, somewhat less and considerably more in certain situation.
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cPSB 2.16 Compact Packet Switch 16 Slot, 14 node, 2F
107PS22616-4157R
CompactPCI CPSB 2.16 6U 16 slot,14 node, 2 fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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2-Channel 500 MHz A/D and 2-Channel 800 MHz D/A with Virtex-6 FPGA - 3U VPX
Model 52650
- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- Two 500 MHz 12-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
