Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Dimensional Metrology
Integrated Metrology Family
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Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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Product
Benchtop Metrology System
FilmTek 2000 SE
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Scientific Computing International
Benchtop metrology system delivering unmatched measurement performance, versatility, and speed for unpatterned thin to thick film applications. Ideally suited for academic and R&D settings. Combines spectroscopic rotating compensator ellipsometry, multi-angle polarized spectroscopic reflection, and intuitive material modeling software to make even the most demanding of measurement tasks simple and reliable.
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Metrology Equipment
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Exact Metrology sells, services and implements metrology equipment from the 3D scanning industry's leading manufacturers. Our highly trained team can configure our comprehensive lineup of portable CMMs, 3D scanners, 3D laser scanners and 3D metrology equipment & digitization equipment and software for practically any application.You'd have to scan far and wide to find a more inclusive selection of 3D metrology equipment. We sell everything from Faro arms to 3D body scanners; white light scanners to blue light scanners; coordinate measuring machines to desktop 3D scanners.
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Metrology
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Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Dimensional Metrology
Stand-Alone Metrology Family
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Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Product
Benchtop Metrology Solution
FilmTek 2000 PAR-SE
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Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Photovoltaic/Solar Metrology System
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Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Product
Metrology Software
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ZYGO has been developing metrology software for decades – our commitment to helping our customers measure confidently, and the heart of our quality guarantee. Our original instrument software, MetroPro, established itself as a gold standard in the optical metrology world. Now, its successor Mx continues that legacy: trusted, easy to use, and heavily customizable.
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Compact General-Purpose Metrology System
Benchmark 250
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The Benchmark 250 is a compact general-purpose metrology system with all the features and capabilities of the larger VIEW Micro-Metrology models. With travel of 300 x 150 x 150 mm, the Benchmark can accommodate a wide range of part sizes, and is rugged enough to be located in either a Q/A lab or an inspection station on the production floor.
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Semi-automated Metrology System
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Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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Product
Dimensional Metrology System
SUMMIT
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The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
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Dimensional Metrology
Fleet Connectivity & Control Family
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Nova’s Fleet Management and Performance Monitoring Center simplify the management and enhance the productivity of Nova tools in the fab. The platform’s ability to process and analyze large amounts of fleet and metrology data using advanced data analytic tools provides our customers with intelligent and predictive insights on tool performance and process trends.
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Product
Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Inspection & Metrology Platform
Neon
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Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
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Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
In-Situ Metrology Etch
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In-situ metrology systems are attached to deposition systems on one or several viewports for monitoring the progression of the etch dept during the process in real time. No matter if the required stop depth lies within a layer or at an interface.
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Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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High Precision 3D Metrology
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Ensure zero-defect quality in all product deliveries and boost customer satisfaction: ISRA’s precision metrology systems measure all object and surface properties down to the nanometer level while ensuring the shortest cycle times.
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Product
Process XRR, XRF, and XRD metrology FAB tool
MFM310
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Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
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2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Advanced Metrology System
AMS Series
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Precision systems for accurate measurement and quality control in semiconductor manufacturing.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Coupler Metrology
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Rosenberger Hochfrequenztechnik GmbH & Co. KG
Rosenberger provides directional coupler-based measurement techniques as well as probes for comprehensive cross-domain coupling analysis.Nowadays, the introduction of new accessories within vehicles, like rear seat infotainment, smart dashboards, and various advanced driver assistance systems, has increased the demand for high-speed automotive bus systems working in parallel with the high-voltage power networks in electric cars.
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Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Metrology Training Services
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As a leading provider of precision measurement equipment we are experts at training new equipment customer on how to get the best out of the equipment and training in the accompanying software functionality. Training can take place at an API facility or your location. Customers will required to pass a competency test and will subsequently receive a certificate of training completion.
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Materials Metrology
VeraFlex Family
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World-class XPS and XRF metrology technologies for semiconductor process control.
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Product
INnLline Metrology Automated & Robotized Solutions
Automation projects
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Bring automation to an existing manual inspection process. Integrate 3D measurements on the shop floor for better traceability. Increase part inspection throughput and reduce cycle times and costs.
