Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Accelerometers - Special Purpose
Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Thyristors Application Specific Devices
A.S.D. (Application Specific Discretes) technology is a vertical integrated power technology using a full planar process. By applying the masking process on both sides of the chip, higher current density is achievable than is possible with epitaxial base or horizontal structures.
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Low Light USB Camera Board (Color)
See3CAM_CU30 - 3.4 MP
See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.
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16 Channel Multihit TDC
VX1290N-2eSST
The VX1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs.
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Time to Digital Converter-1ns 5ch
FMC TDC
Sundance Multiprocessor Technology Ltd.
An FPGA Mezzanine Card (FMC) with a Time to Digital Converter chip to perform one-shot sub-nanosecond time interval measurements.
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JTAG (and IJTAG) Environment Tool Suite
SAJE
SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
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Digital Oscilloscope
MSO/DS7000
The MSO/DS7000 series digital oscilloscope is a mid-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Analysis
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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Emulation
Synopsys ZeBu® emulation system delivers the performance needed to make verification teams and software developers working on the most advanced chips successful. ZeBu emulation systems are modular, allowing users to deploy the capacity needed in a scalable and easily extensible fashion.
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Inspection Microscope
Z-NIR
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Chip Obsolescence Solutions
Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Dummy Test Wafers/Chips
Advanced Dummy Test Wafers/Chips available with over 35 different chip designs and choices of 11 different material configurations as well as kits complete with test vehicles. Custom-make test production of TEG wafer/glass (TEG=Test Element Group). Design and provide custom-make test kit.
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NVM Express
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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Personal Dose Alarm Meter
DP802i
DP802i type X - gamma radiation detector - as a super humanized design and enhanced personal dose monitoring is mainly used for X, gamma rays and hard beta rays of radiation protection monitoring, suitable for nuclear power station, the accelerator, isotope applications, industrial X, gamma NDT, radiation source treatment, medical treatment, cobalt gamma irradiation, radioactive laboratory, nuclear facilities around environmental monitoring field, timely, ensure to my warning safety of staff; The instrument can be also measured dose rate and cumulative dose. It USES reactive new single chip microcomputer, the compensation for the probe, the instrument GM counting pipe has a wide measurement range, better energy response characteristics, and with overload directives and protection function.
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Production Programmers
eltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
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PCI Express Digital I/O Cards With Counters And COS Detection
PCIe-DIO-24DCS, PCIe-DIO-24DC, PCIe-DIO-24DS, and PCIe-DIO-24D,
This product is a x1 lane PCIe DIO board available in four models ranging from basic DIO to advanced COS detection and Counter/Timer capabilities. The card emulates an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C can be further broken into two 4-bit nybbles via software and configured as either inputs or outputs.
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100 High Speed Programmer
Commander Accelerator
The Commander High Speed Programmer (HSP) is low overhead system designed to test Flash Memories, PLA's and Micro-controllers. The parallel multi-module architecture provides the flexibility to program and test multiple devices. It's full-featured capabilities support chip erasing and programming, sector erasing and programming, sector protect and unprotect, and data verification functions.
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High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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10G DFB Laser Diode Chips
Guilin GLsun Science and Tech Group Co., LTD
10G DFB Laser Diode Chips by GLSN
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Patented DPEM Process for Die Removal
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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Digital Tachometer
KM- 2234BL / KM 2235 B / KM 2241
Kusam Electrical Industries Limited
Digital Tachometer uses latest technology for accurate measurements. It has Exclusive one chip of Microcomputer LSI Circuit, It is housed in tough ABS case & has ergonomic design for easy holding in the hand.
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Memory Testing
C.C.P. Contact Probes Co., LTD.
Standard and Custom test solutions for RAM, Flash and many other memory chips.
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SC6-TANGO cPCI® Serial Intel® Atom™ E3900 Series SBC
SC6-TANGO
The SC6-TANGO is a low power CompactPCI® Serial CPU board, based on an Intel® Atom™ E39xx-series System-on-Chip processor (Apollo Lake APL-I).
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Computational Lithography
ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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Pressure Sensors
ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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Universal Programmers
Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
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GO-NR1000 Near-Field Goniophotometer
Hangzhou Everfine Photo-E-Info Co., LTD
Suitable for LED light source, LED chip, module and other small light source, the principal function includes: spatial light intensity distribution curve, spatial color distribution curve, iso-lux curve, total luminous flux, effective luminous flux, spatial luminance curve, etc.The test data can be saved as IESNA (*.ies), CIBSE (*.cib), EULUMDAT (*.ldt), CIE (*.cie), CEN (*.cen) and other formats, which can be directly used as the input data of international general lighting design software. Spatial luminance data can be imported into near-field lighting generation software to generate light data that can be imported into third parties (TracePro and LightTools).
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Thermal Test Chip
Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
