Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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CREE LED’s
Marktech offers the complete line of both CREE LED’s High Brightness LEDs and Marktech’s custom designed components and assemblies which utilize CREE LED’s chips. Our main focus has always been in the area of application solutions to optimize your products performance. Our team of design engineers and R&D scientist are committed to providing you with unsurpassed technical support.
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Automated Programmer Superpro Sb05
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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4-20mA Current Loop D/A Converters
ADI integrated solutions combine both the D/A converter and driver in one chip to provide the required output directly from the digital domain. Analog Devices’ portfolio of leading industrial D/A converters and drivers provides a range of programmable output ranges from standard 4 mA to 20 mA for current loop communication to ±10 V for actuator control. ADI industrial converters offer considerable control functionality and advanced on-chip diagnostics to maximize system uptime, as well as eliminate the need for costly calibration routines needed by some traditional discrete architectures.
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Optical Spectrum Analyzers
Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines.
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QSeven
ROM-7420
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Module Spectrum
nRF52832 Series
Raytac nRF52832 module spectrum covers MDBT42Q, MDBT42 and MDBT42V series with both Chip Antenna and PCB Antenna option for selection.
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O2/N2 Analyzers
GNL-2100 Series
Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-2100 analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%. It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation.
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Digital I/O Card
PCIe-DIO-48JPLS
The PCIe-DIO-48JPS is a 48 channel PCI Express (PCIe) card designed for use in a variety of digital I/O applications. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI digital I/O cards.
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SparkFun Qwiic Thermocouple Amplifier
MCP9600 (Screw Terminals)
The MCP9600 Breakout is a high accuracy Thermocouple Amplifier equipped with an I2C interface, accessed over our Qwiic system. Inside the chip are two temperature sensors, one for the thermocouple itself (the hot junction) and one for the chip itself (the cold junction). As a result, the MCP9600 can read both the ambient temperature and the temperature of whatever you're trying to measure! The MCP9600 can do both with a resolution of 0.0625°C, and an accuracy of ±1.5°C (worst-case). The MCP9600 Thermocouple Amplifier is one of our many Qwiic compatible boards! Simply plug and go. No soldering, no figuring out which is SDA or SCL, and no voltage regulation or translation required!
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3U PXI-E System Controller
PX32101
LinkedHope Intelligent Technologies Co.,Ltd.
PX32101 is a 3U PXI-E system controller based on the newest Intel® Haswell platform. It is designed to provide comprehensive and reliable system controller to support hybrid PXIe-based systems for multiple environments test and measurement applications.Hybrid PXIe-based systems are often required to complete independent diversified complex testing tasks on the PXI test platform. PX32101 provides rich interfaces: 4 USB2.0 / 3.0 for peripheral connectivities; UART for communication or control equipment; dual 1000Base-T Ethernet, one port for LAN connection and the other one for the control of the next generation of LXI instruments. PX32101 can support 4 x4 or two PCIe x8-link, and up to 16GB / s system bandwidth. The ExpressCard 34 expansion slots on the front panel allow users to expand the system modules flexibly. If you install a hybrid multi-slot backplane in the system, then various standard PXI-E and PXI / CPCI peripheral cards could be fitted. In a multitasking environment, PX32101 processor is able to complete multiple tasks independently. The CPU and memory chips soldered with PCB increase reliability performance in shock and vibration environments. Combined with a variety of instrument control interfaces and reliable mechanical & electronic design, PX32101 can meet your hybrid PXIe-based testing for system application requirements perfectly.
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On-Chip Debugging Emulator
E2 Emulator
The new E2 emulator is an advanced on-chip debugging emulator and flash programmer developed based on a concept of "improvement of development efficiency". The download speed is up to twice as fast as the E1 emulator. Moreover, new solutions contributing to reduction in development time will be available.
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6U CompactPCI Intel® Atom™ Processor Blade
MIC-3398
The MIC-3398 is a Low-Power 6U CompactPCI® CPU blade with best in class price/performance ratio tailored for applications that require a state of the art processor platform based on Intel® Architecture with full IO capability at an attractive cost point. The MIC-3398 supports Intel® Atom™ E3845 and Celeron N2930, J1900 SoC (system on a chip) family previously codenamed Bay trail with a maximum of quad-core 2.00 GHz processing performance. Intel® Atom™ technology provides significant increases in performance and energy efficiency by using the 22nm Intel® manufacturing process making it an ideal choice for control and workstation applications that require passive cooling with a power dissipation as low as 10W. Up to 8GB, dual channel 1333 MHz DDR3L memory with ECC support provide a high performance and robust memory interface for demanding applications. With built-in graphics based on Intel® HD Graphics Technology this blade offers a significant improvement in graphics performance compared to previous generation platforms. Support for an onboard 2.5” SATA-II drive as well as CFast SSDs adds comprehensive mass storage support. On the system side, the MIC-3398 supports 32-bit, 33MHz and 64-bit, 66MHz PCI bus interfaces to a CompactPCI backplane. A rich set of I/O interfaces such as DVI-D, USB3.0/2.0, Gigabit Ethernet and RS-232/422/485 ports round off the feature set. In addition to the single slot wide (4HP) board offering, a dual slot wide (8HP) version of the blade offers additional network connectivity by increasing Gigabit Ethernet port count from two to four.
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Presence Sensor
X4M300
The XeThru X4M300 is Novelda’s presence and occupancy sensor powered by the XeThru X4 ultra wide band radar chip. Ultra sensitive and with excellent signal to noise performance, the sensor detects even the smallest human movement in a room.
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Microcontrollers (MCUs)
8-bit
An innovative 8-bit chip design provides a fully-integrated experience. Silicon Labs' 8-bit MCUs are ideal for IoT applications and beyond, delivering the industry's fastest speeds and lowest power.
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Electrical Property Measurement
Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
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Limiter Diodes
The SemiGen SLP7100 series of Limiter Diodes are processed with a high-resistivity epi that have thin intrinsic layers. These devices are typically in the 2 to 20 micron range of epi thickness and can be gold doped to achieve specific performance goals. These diodes are used in passive or active limiter designs in the 100 MHz to 30 GHz frequency ranges. They are ideal for use in high-power applications and can be supplied in chip form or in your choice of packages below.
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Chip Scale TVS Arrays
ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability. To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors. These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.
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BSDL File Validation
Corelis offers services to validate the accuracy of Boundary-Scan Description Language (BSDL) files that characterize the boundary-scan functionality of semiconductor devices. These services include validation of a device's BSDL file while the chip is still in development and BSDL file accuracy verification against actual silicon.
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ALD Applications
Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Solid-State High Power Amplifier 18 - 26.5 GHz
AMP4065LC-2
Exodus Advanced Communications
Designed for EMI/RFI, lab, and general communication applications. Exodus Broadband SSPA product feature GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from Operating Frequency Range 18.0-26.5 GHz.
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Isolated LVDS
Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.
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Inductor Test & Packaging Machine
1870D
The Chroma 1870D Series (1870D/1870D-12) are specifically Designed automated test equipment for chip inductors. It comprises Various test functions that are required for verifying chip inductors. In addition, an automated tape packaging machine at the end of production line is equipped to fulfill demand for automated manufacturing.
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Video Signal Generator
MSPG-6100L
MSPG-6100L is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV9NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex, etc. bad program to protect a person under age through the regulation grade.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Single Phase Multi-rate Static kWh Meter
SY 1035
Hong Kong Songyang Industrial Ltd.
Adopt ADE7755 measurement chip. High accuracy class. Large overload times. Can sum up the absolute value of positive and negative energy. Record power energy of this month, last month, and the month before last.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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PCIe Gen 4 Switch Adapter
P411W-32P
The Broadcom P411W-32P is the industry’s first fully managed Gen 4.0 NVMe switch adapter, providing enterprise class options for NVMe solid state drive (SSD) attach requirements. The P411W-32P leverages Broadcom’s world-class board design, PEX88048 PCIe Gen 4.0 switch chip, and solid firmware expertise, to provide advanced features not available using traditional NVMe drive attach methods. Similar to Broadcom HBAs, the P411W-32P adapter is supplied with fully validated and supported firmware and standards based out of band manageability features.
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FPGA Boards
For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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MEMS Tunable Filter
Optoplex’s MEMS Tunable Optical Filter is based on a patented micro-optic design with MEMS tuning technology. It is an integrated module consisting of a MEMS chip, micro-optics and control electronics and interface. When receiving a stream of optical signals of a plurality of wavelengths from the Input-Port (IN), the 2-port tunable optical filter directs a selected channel to the Output-Port (OUT). Wavelength (frequency) tuning is achieved by changing driving voltage applied to the MEMS chip, via the control electronics and the built-in firmware.
