Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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SparkFun USB To Serial Breakout
FT232RL
This is the SparkFun USB to Serial Breakout for the FT232RL, a small board with a built in USB to serial UART interface. This little breakout is built around the FT232RL IC from FTDI, with an internal oscillator, EEPROM, and a 28-pin SSOP package this is a serious little chip.
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Capacitors - High Q MNOS Series
Macom Technology Solutions Holdings Inc.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss due to our use of nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs high Q MNOS series of capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long term stability.
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Intelligent Power Switches
ST offers a series of intelligent power switches (IPS) for high-side and low-side configurations. These devices integrate the control section (logic interface, drivers, diagnostic and protection features) and the power stage on the same chip, with benefits in terms of compactness, increased system reliability and cost effectiveness.
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Video Signal Generator
MSPG-4600MT
MSPG-4600MT is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV (NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex etc. bad program to protect a person under age through the regulation grade.
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COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Chip Inspection System
GEN3000T
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Moving Die Rheometer
SG-S05A
It tests the feature about vulcanization and searches for the best suitable vulcanization time.It adopts digital intelligent temperature-controller to adjust and sets easily.Its stability, reappear and accuracy is better than the general rotor rheometer.The microcomputer uses import CMOS chip which has high dependability.It draws、calculates and prints automatically,and has copy or blowwing up function. It adopts computer-control and interface to collect、store or deal with data and print test result .This machine's function is better than other types and shows high automatization features. It has functions about curve-comparing and blow up.It uses series of windows operation system flat and graphical software operation interface.The data is dealed with much truly.The user's test operation becomes faster, flexibly and protect conveniently.
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Endpoint / Chamber Health Monitor based on Optical Emission Spectroscopy and MWL Interferometry
EV 2.0 Series
To address new requirements in Semiconductor, lighting devices, automotive components, flat panels, MEMS sensors, memory chips, and logic electronics processed in the industry using dry etch, cleaning and (PE)CVD, HORIBA has introduced a unique generation of sensor dedicated to Advanced Endpoint Control, Fault Detection and Chamber Health Monitoring.
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Coating And Finish Durability
Our capabilities: Adhesion. Impact Resistance. Gravelometer. Chemical Resistance. Cyclic Corrosion. Hardness. Chipping. Resistance. Water Immersion
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Module Spectrum
nRF51822 Series
Raytac nRF51822 module provides 16K & 32K RAM option with Chip Antenna & PCB Antenna for selection.
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Simics
With Wind River® Simics® you can simulate anything, chip to system, giving you a path to DevOps and Continuous Integration and Deployment.
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Cloud And Networking
From laser chips (EMLs, DMLs, and VCSELs) and pluggable coherent transceivers to pump lasers and TrueFlex® colorless/directionless/contentionless ROADMs, Lumentum’s comprehensive, vertically integrated portfolio lowers costs and speeds time-to-market. We optimize our components for best-in-class performance, creating flexible and scalable platforms that address ever-changing market conditions and product migrations. To ensure field reliability, Lumentum uses only the best materials and processes including stringent, proprietary burn-in processes during laser manufacturing.
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ISDN Chip Set
Emutel Symphony
Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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IF/RF Receivers
IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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ICs For Wireless Charging System
The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Digital Mission Engineering
From chip to mission, connect modeling and simulation efforts across all phases of the engineering product life cycle. Model multi-domain operational environments, including land, sea, air and space, with accurate, dynamic, physics-based simulations. Integrate with the Ansys portfolio of multi-physics tools and solvers to achieve unmatched end-to-end modeling and simulation.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Netlist Analyzer
GateVision
GateVision PRO is the third generation of graphical netlist analyzers from Concept Engineering. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips with intuitive design navigation, schematic viewing, logic cone extraction and interactive logic cone viewing for debug support and design documentation.
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Smart Lighting
The AS721x/AS722x are complete System-on-Chip (SoC) sensor-integrated IoT smart lighting managers for color-tunable white lighting applications. They also support daylight harvesting and color/lumen maintenance lighting applications. 0-10V control and network-enabled high-level command inputs are combined with industry-standard PWM and 0-10V outputs for direct control of LED power systems.
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Button Impact Tester
TESTEX Testing Equipment Systems Ltd.
Button Impact Tester, to determine the impact resistance of plastic sew-through flange buttons to a falling mass of 0.84kg (29.5oz), released from a height of 67mm (2.625 inches) or other heights as required. Cracking, chipping or breakage constitutes failure.
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Temperature/ Humidity Meters
The Temperature /Humidity Meter has a highly accurate sensor chip to measure relative humidity and temperature. It is perfect for many industrial applications, laboratory and other types of work locations.
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Source Signature Recorder
*GPS accuracy for time break collection and source equipment locations.*32-bit, high speed, ADC chip for lower noise and increased accuracy for signatures.*Operates independently of crew, including observer and shooter or operators.*Can be used with any Vibrator Control System.*Great for monitoring rental equipment and operators.*Provides accurate start times that can be used with any nodal recording system.
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Digital Step Attenuators
Analog Devices provides a range of broadband IC digital attenuators that come in low cost, leadless surface mount packages. Our digital attenuator family offers excellent attenuation and includes off chip ac ground capacitors for near dc operation, making it ideal for an extensive number of RF and IF applications.
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Thin Film Chip Resistors, High Voltage Type
Panasonic Industrial Devices Sales Company of America
Thin Film Chip Resistors, High Voltage Type by Panasonic
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Chip Rings
Panasonic Industrial Devices Sales Company of America
Extremely robust Chip Rings for signal measuring terminals featuring a metal sheet structure for high reliability.
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Chip Inductors
Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today’s Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint.
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Smart Sockets
Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Caibration Equipment For Lab Use
In the field of high-power semiconductor testing, PONOVO has launched a smart test platform with high-speed high-frequency, high-voltage, high-current power sources, combined with high-speed, high-precision high-voltage, high-current analog acquisition technology and high-speed digital processing control system. The platform can complete the testing of dynamic parameter parameters, static parameters, thermal parameters and mechanical parameters, and power life parameter of various types of high-power semiconductor devices, modules, and chips, which could meet different testing requirements. It is the universal testing platform for automated testing for different application purpose, such as the research and development testing, engineering acceptance test, factory acceptance test, etc.
