Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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RF Signal Generators
The G6 VSG from Transcom Instruments is a Vector Signal Generator that operates from 10 MHz to 6 GHz. It can simulate GSM, EDGE, CDMA, TD-SCDMA, WCDMA, CDMA2000, TD-LTE, FDD-LTE, NB-IoT, and LoRa base station signals for production and calibration of UE, chips. The signal generator has a dynamic range (power range) from -100 to 10 dBm and an in-built automatic gain control function. It is available in a module that measures 180 x 50 x 290 mm and is ideal for educational practices, wireless monitoring, mobile communication, aerospace and national defense industry in terms of research, manufacturing, testing and measurement, and electronic countermeasure.
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Fibre Channel Modules
AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
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Accelerometers
Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Digitizer
742 Family
The 742 is the Switched Capacitor Digitizer family, based on the DRS4 chip by PSI, with the highest sampling frequency (5GS/s) and channel density. It can record very fast signals from scintillators coupled to PMTs, Silicon Photomultipliers, APD, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis. The 742 family has an additional channel (two channels in case of VME boards) which can be used as time reference for time of fight measurements. The resolution of this kind of measurements can reach up to 50 ps.
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Wi-Fi Solution for IoT Devices
SX-NEWAH
Powered by NRC7292 System-on-Chip from Newracom, SX-NEWAH is industry’s first IEEE 802.11ah Wi-Fi module that operates in the Sub 1GHz license-exempt band. It provides a much greater range over 2.4GHz and 5GHz Wi-Fi technologies and a much higher data rate than propriety Low-Power Wide-Area (LPWA) technologies such as LoRa and Sigfox.
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Read-Write Analyzers
Guzik Read/Write Analyzers (RWA) work in conjunction with Spinstands to write data to the disk media and read back the signal for detailed analysis. We have two RWA-4000 series available for For Two Dimensional Magnetic Recording (TDMR) and non-TDMR technologies. The RWA 4000 series offer upto 8Gbit/sec maximum write data rate and 3.5 GHz analog bandwidth for all parametric measurements. Each RWA features a pattern generator with 1psec resolution of bit pre-compensation and supports PRML chip integration. Servo writing and processing is provided for Guzik Spinstand models. Select the pre-amplifier (UP14) as well as a variety of enhancements including programmable filters and PRML chip adapters.
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Encoders
DekTec encoder cards use hardware compression chips to achieve very low CPU overhead. Ideal for converting the output of your video-generating application to H.264 in real-time, without consuming precious CPU cycles.
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ARM LPC2364 Board
MS 1541
- 128KB On chip Flash- 16*2 line LCD Module interface- Two CAN channel at 1MPBS- Ethernet interface which supports 10/100 MBPS- Full Modem RS232 interface- RS485 interface- RTC (Real Time Clock)- 2048 bits serial EEPROM with data protect and sequential read.- 24 ULN outputs of 12V level.- Eight 110V DC inputs interface.- Six digital inputs interface- Four on board keys interface- Power delay circuit for external use- ON board inspection circuit
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PANAVIA Modules
AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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Analyze RTL
ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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Digital Oscilloscope
MSO8000
The MSO8000 series digital oscilloscope is a mid- to high-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Solid State Power Amplifiers
Skylink SSPAs incorporate state-of-art DPD and well-done Heat Dissipation technologies with available LDMOS, GaN & GaAs Chips. Solutions of SSPA frequency range from 9kHz to 50GHz and output power up to kilowatts and includes basic PA modules to integrated chassis with embedded software for local and remote control and monitoring.
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Receiver Conformance Test Application for IEEE 802.3bm
M8091BMCA
IEEE 802.3bm Receiver Test Application for 25GAUI-1 Chip-to-Module, Chip-to-Chip, Cable and Backplane.
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Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Chip Shunt Resistors: ACQ-200
ECS
These models have high conductive heavy copper connectors, excellent long term stability and low inductance. Maximum soldering temperatures is up to 350C 30 sec.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Ka-Band Silicon SATCOM Tx Quad Core IC
AWMF-0109
The AWMF-0109 is a highly integrated silicon quad core chip intended for satellite communications transmit applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain per channel with an output power of +12 dBm per element per polarization. Additional features include gain compensation over temperature, temperature reporting, and Tx output power telemetry. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Material Identification Spectroscopy
ChipCHECK
Gastops specializes in advanced fluid sensing and analysis systems specifically designed and developed for critical equipment condition monitoring applications. ChipCHECK offers the fastest way of making on-site equipment maintenance decisions. It is a field deployable analyzer designed for rapid on-site identification of equipment lube oil. This automated maintenance decision-support tool employs innovative laser spectroscopic technology, which enables on-site analysis of microscopic chip debris. ChipCHECK provides the maintainers with quick, reliable, and conclusive information, including the total number of particles, and the size, shape, and specific alloy classification for each individual particle on the sample.
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Single Channel Detectors
Infrared detectors for gas analysis, flame detection and radiometry in TO18 or TO39 packages.Housing types TO18 and TO39Voltage or current modeSignal processing with JFET or operational amplifierThermally compensated (optional)With special chip holder for reducing the microphonic sensitivity (optional)
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Dry Systems
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Mechanical Stress Card Testing
Wheels are transversely positioned with micromechanical stopsPressure exercised on the card's chip and microcircuitryThe card is free to deform in the Z axisThe stress is controlled by an accurate, precise force sensorProgrammable number of cycles
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96/48-CH Opto-22 Compatible PCI Express Digital I/O Cards
PCIe-7248/7296
ADLINK"s PCIe-7248/7296 are high-density parallel digital I/O boards with 96/48 I/O channels. The header connectors are fully compatible with industry Opto-22 standard. Thus, PCIe-7248/7296 can utilize the Opto-22 external devices. The PCIe-7248/7296 devices emulate mode 0 of the industry standard 8255 programmable peripheral interface (PPI) chips. The PCIe-7248/7296 provides 4/2 PPI chips respectively. Each PPI offers three 8-bit ports: Port A, Port B and Port C. The Port C is divided into 2 nibble-wide (4-bit) ports. The PCIe-7248/7296 devices have programmable timer/counters. One 16-bit counter is available for event counting, while the other 32-bit timer is available for timed interrupt generation. The PCIe-7248/7296 devices provide multiple programmable interrupt sources from DIO channels, as well as the output of the timer.
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AC Quantum Voltmeter
are based on a programmable Josephson voltage standard chip and are used for high-precision voltage measurements in the range from dc and ac to kHz frequencies.
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Compact Professional IC Tester
ChipMaster
The ABI ChipMaster Compact Professional is a low-cost, hand-held out-of-circuit IC tester. The ChipMaster is designed for testing digital ICs with up to 40 pins through a ZIF socket (see LinearMaster for analogue devices). A range of adapters is also available for SOIC and PLCC devices.
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Tantalum-Polymer
POSCAP™
Panasonic Industrial Devices Sales Company of America
Panasonic POSCAP™ Solid Electrolyte Chip Capacitors offer stable capacitance at high frequency and temperature, with low-ESR/ESL. These Capacitors utilize a sintered tantalum anode with a proprietary high-conductivity polymer cathode. Panasonic's innovative construction and processing yields one of the lowest ESR levels in Tantalum-Polymer Capacitor technology, while exhibiting excellent performance in high frequency applications. POSCAP Capacitors are available in various, compact package sizes for a small PCB footprint while offering high volumetric efficiency for capacitance. In addition, Panasonic’s POSCAP parts demonstrate high reliability and high heat resistance, making them the ideal Chip Capacitor for digital, high-frequency devices and more.
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Semiconductor Test Equipment
Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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8 Channel Sample & Hold and Signal Conditioning Board for Group3
All channels provide for voltage division ahead of transient suppression before going into the S&H ICs. Channels that are sampled and held use a common sample and hold pulse that samples while high and holds while low. Jumpers on each S&H chip allow buffering of analog signals where sample and holds are not required. An advantage to the buffers is that it provides a high input impedance for high impedance voltage dividers.
