Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Generates Test Cases on ICE
TrekSoC-Si
TrekSoC-Si automatically generates self-verifying C test cases to run on the embedded processors in SoCs in in-circuit emulation (ICE), FPGA prototyping, and production silicon. This verifies your chips more quickly and more thoroughly than hand-written diagnostics or running only production code on the processors. TrekSoC-Si's generated test cases target all aspects of full-SoC verification and work in a variety of different environments. TrekSoC-Si is a companion to TrekSoC, which generates test cases for simulation and acceleration. TrekSoC-Si extends the benefits of TrekSoC into hardware platforms.
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Multi-Contact Wedge
The GGB Industries MULTI-CONTACT WEDGE allows for more chip design flexibility because it is custom configured to your circuit. Four Wedges can be used at the same time to probe a complete chip.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/cd
M8091BSCB
IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Services
For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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OBD Chips
STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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High-Speed Analog Output
High-speed analog output photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a PIN photodiode and high-speed amplifier transistor on the output side in a single chip.
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Microelectro Mechanical Systems And MEMS Sensors
NevadaNano has spent a decade integrating multiple, complementary chemical sensors on a single silicon chip. We call it the Molecular Property Spectrometer™ (MPS™). The MPS Gas Sensor works together to measure a variety of thermodynamic and electrostatic molecular properties of sampled vapors, liquids, and particles. In less than a second, the chip creates a large, rich dataset of chemical information. Then, Custom MPS software identifies the types of molecules present in an unknown sample.
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Isolated Relay I/O Card
mPCIe-IIRO-8
The mPCIe-IIRO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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Mezzanine System
5158
The 5158 Electrical Conversion Module (ECM) provides eight (8) RS-232 outputs and eight (8) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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96-CH High-Driving DIO Card
PCI-7396
The PCI-7396 is 96-bit parallel digital input/output (DIO) cards designed for industrial applications. The PCI-7396 emulates four 8255 Programmable Peripheral Interface (PPI) chips. Each PPI offers three 8-bit DIO ports which can be accessed simultaneously. The total 12/6 ports can be configured as input or output independently.
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Embedded Antennas
Embedded chip antennas are compact and integrated antennas designed to be directly mounted on a printed circuit board (PCB) or embedded within electronic devices. These antennas are often used in wireless communication applications, such as Wi-Fi, Bluetooth, GPS, and IoT devices, due to their small size and ease of integration.
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IR Linear and 2D Sensor Array Modules
Excelitas offers Linear and 2D IR Imager Arrays based upon our Thermopile Technology. All Arrays are provided as plug-and-play Modules featuring a sensing chip, robust metal housing with focusing lens, a PCB with microprocessor for calibration and bus interface and a quick connector for streamlined plug-and-play integration. We offer 8-pixel, 16-pixel and 32-pixel Linear IR Imager Array Modules for field-proven effectiveness in scanning presence detection, non-contact temperature measurement, smart-home products, and office electronics. Custom solutions also available upon request.
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STANAG3910/EFEX Modules
AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.
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Electronic Ballast Analyzer
WT3000
• It has 8 windows to display each parameter of input and output characteristics • Frequency response for testing input current up to 1MHz, suitable for precise testing of various kind of electronic ballast • WT3000 has expanding analysis for envelope wave. • Symmetry analysis for envelope wave’s crest factor of lamp current • Sampling at ultra-high speed, dynamic analysis single frequency curve, highest sampling frequency is up to 10MHz • Portable with built-in chip micro-processor, particular suitable for development and spot production • RS-232C standard interface can be connected to PC, English version software can run in WinXP or Win7
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Programmable DC Electronic Load
M97 series
The new M97XX series programmable DC electronic load is a new generation product designed from Maynuo Electronic Co.,Ltd. Incorporating high-performance chips, the M97XX series delivers high speed and high accuracy with a resolution of 0.1 mV and 0.01 mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs). M97XX series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar celland fuel cell etc.test and measurement applications. From 150W to 200KW, there are many models to choose from :
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Flight Processor Emulator
Flight Processor Emulators are an essential part of satellite simulators – both for testing of flight software and at the heart of operational simulators. The Terma Emulator is a suite of instruction-level emulators, based in the ESOC Emulator Suite, supporting several processors used in the Space industry: MIL-STD-1750 in both A and B variants. ERC32 in both 3-chips configuration (691-E) and single chip configuration (695-F). LEON 2 (AT-697)...
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Synchro to Digital-Resolver to Digital Converters
MRDC
Computer Conversions Corporation
Computer Conversions’ MRDC64-3 is a miniature single chip solution for providing a complete 1 x 64 speed resolver interface into any demanding industrial or military application.
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Microcontrollers
Frontgrade offers highly integrated, full-featured SPARC and Arm®-based Rad Hard microcontrollers ideal for system-on-chip (SoC) applications. These small footprint, low power devices are augmented with integrated analog front-end components making them ideal for mixed signal processing.
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USB Solutions
Arasan Chip Systems provides a complete suite of USB-compliant IP including low speed, high speed and super speed USB products. Arasan became a member of the USB-IF standards body in 1996 and delivered its first USB 1.0 IP product in that year. The offering expanded to USB 2.0 products in 2000 and USB 3.0 products in 2009. Arasan's customer base includes many major systems and SoC companies in variety of industries.
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Big Easy Driver
The Big Easy Driver, designed by Brian Schmalz, is a stepper motor driver board for bi-polar stepper motors up to a max 2A/phase. It is based on the Allegro A4988 stepper driver chip. It's the next version of the popular Easy Driver board.
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Memory Interface Chips
Providing memory bandwidth and capacity to unleash the power of multicore processors
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OpenVPX SBC
SBC347D 3U
The VPXcel3 SBC347D rugged single board computer is based on the highly integrated Intel® Xeon® D processor platform. The multiple core Xeon D brings the high performance of Intel Xeon processors into a dense, low power system-on-chip solution, ideal for High Performance Embedded Computing (HPEC) applications.
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Radio Module (2x2)
SX-PCEAC2
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Electronic Inspection Systems
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Rectifier Diodes
Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Actuators, Adjusters, & Transducers
We offer a wide range of adjustment screws, micrometers, and kinematic positioners, as well as stepper motor, DC servo, high-precision piezo inertia actuators, and voice coil actuators. Additionally, our piezoelectric offerings include modular, screw, and replaceable-tip piezoelectric actuators, as well as Langevin transducers for ultrasonic welding applications. A wide variety of piezoelectric chips and stacks are also available.
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Optical Sensors
Vishay's proximity, reflective, transmissive, slotted interrupters, optical and ambient light sensors put the "smart" into smart devices. Advantages of Vishay sensors include best-in-class performance, in-house chip manufacturing and assembly including AEC-Q101 automotive grade product lines, and comprehensive range of package types for wide range of applications.
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Ultra High Speed Programmers
With superpro/7500 as the representative of the high-speed programmer, support chip comprehensive, burning faster, is adhering to the Superpro family's outstanding pedigree of the latest professional intelligent general programmer/burner/burner. Relying on Xeltek powerful device.
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2.5G DFB Laser Diode Chips
Guilin GLsun Science and Tech Group Co., LTD
2.5G DFB Laser Diode Chips by GLSN
