3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Product
Entry-level X-ray Inspection System
X-eye 5100 Series
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100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed and high-resolution image can be gained.Customer convenience is primarily considered in operation and maintenance of the product.Customization is available because it is specially designed to be add up any necessary functions depends on customer needs with reasonable prices.
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Product
Automated QC Inspection Solutions
R-Series
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The Best Alternative to Traditional Coordinate Measuring Machine (CMM). The R-Series product line will help you eliminate bottlenecks at the traditional coordinate measuring machine. These new solutions, when added to the production line, will help increase productivity through quality control processes that require no human involvement.
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Product
Silicon Inspection System
NIR-01
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The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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Product
3D Scan Systems
intelliWELD
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The intelliWELD is a 3D scanning unit for remote laser welding applications. While a robot leads the scan system along the processing line, the scan unit ensures the fast and precise positioning of the laser spot.The intelliWELD scan unit allows elimination of complex robot movements and fast repositioning, reducing the repositioning time between the welds to a few milliseconds.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Inspection Microscope/Video
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Connector end face contamination is a big problem with fiber optic cables and patch cords and it causes network issues. If you are a professional technician, you need a quality optical microscope. The magnification of connector end faces will allow you to discover any quality problems such as scratches. You need to make sure you have a clean connection with no dirt and debris. Visual inspection is fast, easy and simple. Using this test equipment can help avoid problems.
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Product
3D inversion geophysical software for Resistivity and Induced Polarization Data
RES3DINV
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This program is designed to invert data collected with a rectangular grid of electrodes. The arrays supported include the pole-pole, pole-dipole, inline dipole-dipole, equatorial dipole-dipole and Wenner-Schlumberger. The RES3DINV program uses the smoothness-constrained least-squares inversion technique to produce a 3D model of the subsurface from the apparent resistivity data alone.
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Product
Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
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*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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Product
Reflow Soldering Machines
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Shenzhen Leadsmt Technology Co.,Ltd
Used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven.
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Product
In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
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X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Product
Smart Factory Inspection System
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API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
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Product
On-site EL/PL Inspection Machine
“EPTiF”
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"EPTiF (EL/PL Test in Field)" enables you to check invisible conditions of installed solar panels during daytime by EL and PL inspections, which are adopted by a number of solar panel manufacturers, without detaching solar panels. Irradiance-independent and steady results can be obtained. This is the first in the industry.
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Product
3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a powerful 3D semiconductor and MEMS process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex 3D structures created in the fab. Because the full integrated process sequence is modeled, SEMulator3D has the ability to predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.
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Product
Analog Ultrasonic Inspection System
ULTRAPROBE 100
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The Ultraprobe senses high frequency sounds produced by operating equipment, leaks and electrical discharges. It electronically translates these signals by heterodyning them down into the audible range so that a user can hear these sounds through a headset and see them as intensity increments on the meter. Heterodyning works the same as a radio in that it accurately transforms the sounds so that they are easily recognized and understood.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Universal Paint Inspection Gauge
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The byko-cut universal is a multi-purpose paint testing instrument that measures paint coating thickness, paint adhesion, and coating hardness.
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Product
3D Scanning Software
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Software is a comprehensive component to any advanced metrology system. Combined with laptops and portable equipment, 3D scanning and measurement is now possible virtually anywhere. 3D scanner software plays a critical role in every stage from the creation of a concept design to the manufacturing and inspection of prototypes. Below is a look at some of the Laser Scanner Software and 3D Scanner Software providers and platforms we represent and handle.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Semiconductor / FPD Inspection Microscope
MX61L
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Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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Product
Radiographic Inspection Test
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The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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Product
3D Scanners
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The process of analyzing a real-world object or environment to collect three dimensional data of its shape and possibly its appearance (e.g. color).
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Product
96-Pin 1.27mm Pitch Female Solder Pad Connector With Backshell, Screwlocks
C096SFR-4SP-5A
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This connector is designed to allow users to discrete wires using solder pad connections to the 96-Pin 1.27mm pitch connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
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Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
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Product
Foreign Matter Inspection Device For FPDs
HS-930
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By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
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Product
Visual Visual Inspection Device
IP-3000
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Our visual visual inspection device Inspection Pro IP-3000 is an inspection device that quickly and accurately inspects the mounting board, which is constantly evolving, and judge whether it is good or bad without omission.
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Product
3D Scanner
Artec Eva Lite
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Eva Lite is the budget version of the bestselling white light Artec Eva 3D scanner. It features the same accuracy specs, but with reduced functionality: Eva Lite has geometry only tracking and capture. As a result, this affordable 3D scanner can be used for making high quality textureless 3D scans when scanning geometrically rich objects, such as the human body.
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Product
Multicore Universal Solderability Tester
MUST System 3
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The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Product
3D Guidance®
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The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.
