3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Portable Metrology‑Grade 3D Scanner
Black Series
The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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Integrated NDT Inspection Device
FlawHunter
The FlawHunter is an integrated NDT inspection device, equipped with an advanced, high-resolution Laser Shearography sensor with a vacuum (partial) excitation system. It is ergonomic & easy-to-use and is equipped with a workflow-oriented, GUI-display and left/right-hand button control. Regardless of the application, the FlawHunter provides reliable and resolute measurement results for in-field (service) NDT and quality control (post-production) operations.It can be used on any material & surface provided a stable vacuum can be generated within the vacuum seal (viewable inspection area).
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Baggage and Parcel Inspection
Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
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The Complete Solution for Optical Surface Quality Inspection
OptiLux SD (Scratch-Dig)
RedLux’s OptiLux SD system provides the complete solution for control of optical surface quality (scratch-dig) by offering a breakthrough in measurement performance along with conformity to industry standards. Designed with flexibility in mind and further enhanced by a range of customer inspired features, the OptiLux SD can support the most demanding of optical surface quality inspection processes, from highly customized optical components in low volume, to standard components in high volume.
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Desktop 3D Scanners
Automated 3D Scanning for small to medium sized parts. Desktop scanners offer a more compact solution with great accuracy.
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Offshore Inline Inspection
Data quality and first-run success represent the founding principles of NDT Global. By providing highly accurate results, in the first instance, our customers can have confidence in the inspection data to make fully informed decisions on future interventions - be that extending the inspection interval or making required repairs while, at the same time, also limit the requirement for costly verification's. Our latest generation of tools represent a step change in pipeline inspection accuracy and can significantly reduce overall project cost.
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Replacement Solder Tip Leadset for Use with D420/620
Dx20-SI-HiTEMP
The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
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Digital Automated Interferometer for Surface Inspection
DAISI
DAISI (Digital Automated Interferometer for Surface Inspection) achieves the high workability and repeatability with the features such as auto-focus function, auto-calibration function and auto connector fixing system.
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Automated Inspection Systems
Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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X-ray Inspection System
RTX-113™
Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Testing And Inspection Devices
HEIDENHAIN offers testing and inspection devices that deliver all setup, monitoring, and diagnostic data needed for the analysis of its encoders. Grid encoders from HEIDENHAIN are ideal for machine tool inspection and acceptance testing, accurately measuring CNC machine tool movements in both static and dynamic inspection.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Video Inspection Probe
With today's high data rates and high definition services, connector quality and inspection has never been so important. Research reveals that up to 75% of all optical network failures are attributed to poor connector quality - reduce your installation time and ensure your network is reaching its full potential.The Video Inspection Probe (VIP) application for Anritsu field testing platforms gives operators a safe, easy way to analyze and document connector conditions.
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3D Scanning System
CyberGage360
Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection.CyberGage360 dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing floor; Lowers Cost of Quality & Speeds Up Product Time-to-Market. Designed for use in general purpose metrology, the CyberGage360 has a range of potential industrial applications from automotive to aerospace to consumer electronics, where high accuracy and high speed throughput are important.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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Over-Line Vision Inspection System
Over-Line vision inspection systems utilize a compact sensor head mounted directly over an existing production line to scan every object that passes underneath, in any orientation and at any belt speed, in order to generate a continuous stream of critical QA data, such as size, shape and color attributes, and production metrics such as throughput, uptime and capacity.
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X5C Compact X-Ray Inspection
Designed with packed convenience food, ready meals and small packaged goods in mind, the X5C is LOMA's smallest X-ray system available, with a machine length of 1000 mm and offers excellent Critical Control Point (CCP) protection in the smallest footprint possible - and manufactured under LOMA's Designed to Survive philosophy to provide one of the toughest systems on the market.
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Coax, Patchcord, ITA, 20", Mini Coax, Solder Sleeve, RG316 Tan, Single-Ended
7-339116000-036
Mini Coax, ITA, Solder Sleeve (50 Ohm, 2 GHz) to RG316 Tan (50 Ohm, 3 GHz).
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X-ray inspection system for BLU, LED Long bar products
X-eye 9000LED
X-ray Tube100kV / 200uAMin. Resolution5µmTable Size1,500mm X 500 mmDetectorFlat Panel Detector (High sensitivity)Dimension3,620(W) x 1,065(D) x 1,590(H)mm / 850kg
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3D Scanning Software
Software is a comprehensive component to any advanced metrology system. Combined with laptops and portable equipment, 3D scanning and measurement is now possible virtually anywhere. 3D scanner software plays a critical role in every stage from the creation of a concept design to the manufacturing and inspection of prototypes. Below is a look at some of the Laser Scanner Software and 3D Scanner Software providers and platforms we represent and handle.
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Thickness and Flaw Inspection
OmniScan MX2
The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard COMPACT
Rotary Precision Instruments UK Ltd
Designed for horizontal or vertical applications with a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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Real-time X-ray Inspection Systems
JewelBox Series
JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Connector, 104-Pin D-Type Male, Solder Bucket, 5A
92-960-104-M
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied without backshell. This connector is not compatible with Pickering modules that use the 104-pin D-type connector.
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3D Optical Microscopy
Bruker is the worldwide leader in 3D surface measurement and inspection, offering fast, non-contact analyses for samples ranging in size from microscopic MEMS to entire engine blocks. Our microscopes are the culmination of ten generations of proprietary Wyko® Technology advances that provide the high sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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