Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Coating Thickness Gauge
456
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The Elcometer 456 dry film thickness gauge is available in four different models. Each thickness gauge provides the user with increasing functionality - from the entry level Elcometer 456 Model E, to the top of the range Elcometer 456 Model T.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Thickness Gauge
124
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The Elcometer 124 Thickness Gauge is used to measure the peak-to-valley height of a surface profile moulded in the Elcometer 122 Testex® Replica Tape.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Ultrasonic Thickness Guage
KM 130D
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Kusam Electrical Industries Limited
Ultrasonic Thickness Guage is an intelligent hand held meter which adopts ultrasonic measuring principle, & is controlled by micro processor, provides quick & precise measurement of thickness for most of industrial material. This unit is widely used in various precise measurement for different hard ware / parts in industrial realm; one of its important application is to monitor the level of thickness-decreasing during operation of various & pressure container. Diffusely applied in manufacture fields, metal processing, and commercial inspection. The material that conduct & reflect constant sonic velocity, this product is to be applicable to used.
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Product
Coating thickness XRF Standards
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We manufacture high accuracy reference standards capable of calibrating virtually any X-Ray Fluorescence (XRF) coating thickness and composition analysis system.
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Product
Material Thickness Gauges
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PeakTech Prüf- und Messtechnik GmbH
Can use the speed of sound to measure the material thicknesses of most sound wave conducting materials, such as metal, glass, plastic, ceramics and much more. In addition to the high resolution of 0.1 mm, the device also offers a self-calibration function for maximum accuracy via a 4 mm metal plate integrated in the housing.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Thickness Gauge
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Hildebrand Prüf- und Meßtechnik GmbH
You can select a Thickness Gauge based on a specific standard, a specifiy material or foot diameter and weight/pressure.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Paper Thickness Tester
DRK107A
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Shandong Drick Instruments Co., Ltd.
DRK107A Paper Thickness Tester is professionally applied to testing the thickness of paper specimens.
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Product
Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Thick Film Bleeder
GBR-351
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GBR-351 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 965). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Product
Thickness and Flaw Inspection
OmniScan MX ECA/ECT
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With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Film Thickness Mapping Systems
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Angstrom Sun Technologies, Inc.
Spectroscopic reflectometer mapping (SRM) tools are for industry or lab routine thin film uniformity measurement. This is relatively low cost and easy to use setup. Mapping size can be configured from 2" to 18" if needed. Dependent on film thickness range, a broad wavelength range can be configured within DUV, Vis and/or NIR range. A user-friendly software interface allows you to define various mapping patterns to map. A CCD array based detecting and data acquisition mechanism offers fast measurements. 2D/3D data presentation gives user option to quickly generate reports.
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Product
Thickness and Flaw Inspection
OmniScan MX2
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The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Product
Moisture / Thickness / Density Meters
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On-line multi IR wavelength analyzer utilizing infrared absorption technology for measuring product constituent and/or thickness.
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Product
Coating Thickness Measurement
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The Calotest instruments from Anton Paar provide quick, simple and inexpensive determination of coating thicknesses. Employing the simple ball-cratering method, the thickness of any kind of single or multi-layered coating stack is accurately checked in a short time, in full compliance with relevant international standards.
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Product
Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Product
Ultrasonic Thickness Gauge
UTG-1500
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The new PHASE II UTG-1500 is a hand held microprocessor controlled ultrasonic thickness gauge specifically designed for measuring the thickness of metallic and non-metallic materials such as aluminum, titanium, plastics, ceramics, glass and any other good ultrasonic wave-conductor as long as it has parallel top and bottom surfaces.
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Product
Precision Coating Thickness Gauge
355
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The Elcometer 355 Coating Thickness Gauge watchwords are accuracy, simplicity, versatility and durability, making this a state of the art hand-held measuring system packed with time-saving and cost-saving features.
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Product
Underwater Thickness Gauge
Multigauge 4000
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The Multigauge 4100 and 4400 ROV Underwater Thickness Gauges mount onto most types ROV. There are two models in the range, the Multigauge 4100 which has a depth rating of 1000m and the Titanium Multigauge 4400 which has a depth rating of 4000m.
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Product
Automotive Paint Thickness Meters
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Shenzhen Linshang Technology Co., Ltd.
Linshang automotive paint meter, also named paint thickness meter, is a painting thickness gauge used to test car paint thickness. Linshang automotive paint meter can identify the substrate automatically. If you devote to find a cost effective paint thickness meter, you can view the digital coating thickness gauges listed below.
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Product
Ultrasonic Thickness Gauge
38DL PLUS
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The 38DL PLUS is an innovative instrument that signals a new era in ultrasonic thickness gauging. Ideally suited for almost every ultrasonic thickness application, this handheld thickness gauge is fully compatible with a full line of dual and single element transducers. The versatile 38DL PLUS can be used in applications ranging from wall thinning measurements of internally corroded pipes with dual element probes to very precise thickness measurements of thin or multilayer materials with single element transducers.
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Product
Surveyor Thickness Gauge
Multigauge 5650
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The Multigauge 5650 Surveyor Thickness Gauge is a simple, robust ultrasonic thickness gauge designed specifically for ship and small craft surveyors, but can also be used in applications where different measurement modes are required. The user has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. The gauge can be used for metal, GRP or plastic measurement and it automatically switches modes and settings depending on the type of probe fitted. The easy to use keypad on the Surveyor Thickness Gauge allows operator interface whilst the bright LCD display can be used in all light conditions. All probes have Intelligent Probe Recognition (IPR), which automatically adjusts settings in the gauge at the same time as transmitting recognition data the result is a perfectly matched probe and gauge for enhanced performance. Additionally, the Automatic Measurement Verification System (AMVS) used with multiple echo ensures only true measurements are displayed, even on the most heavily corroded metals.
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Product
Film and Paper Thickness Gauges
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Economical, Accurate, Easy-to-Operate, our line of off-line paper / film thickness gauges are manufactured to meet TAPPI specifications for paper or ASTM specifications for film.
