Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
-
Product
Semiconductor Test & High-Speed Digital
-
Rosenberger Hochfrequenztechnik GmbH & Co. KG
The wide product range means that a variety of semiconductor test applications and high-speed digital applications are possible. To meet the ever-challenging technological requirements and increasing demands of the semiconductor test equipment industry, Rosenberger has developed and produces multiport mini-coax connectors and cable assemblies – for applications up to 40 GHz – , and spring-loaded coax products. Probes and customer-specific cable assemblies are also available.
-
Product
Thermalyze Extension for Steady State Analysis
Lock-In
-
Steady-state thermography is limited to detecting hot spots that heat up a minimum of 100 mK (0.100°C). This may be useful for locating shorts on high-power devices, but is inadequate for detecting low power defects such as semiconductor device leakage current or short circuit with very low or very high resistance. Steady-state thermography also suffers from poor spatial resolution as the heat from localized hot spots diffuses rapidly, blurring the location of the heat source.
-
Product
Dopant
-
In semiconductor manufacturing, electrical performance starts with atomic-level control. Dopant technologies make that possible by introducing carefully measured doping constituents that help devices conduct, switch and perform reliably. For precise control of fluxes for Molecular Beam Epitaxy (MBE) dopant constituents, or for gases that do not require thermal cracking, Veeco’s Dopant products are ideal.
-
Product
Air-Cooled Universal Test Platform
Diamondx
-
Diamondx semiconductor test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
-
Product
MPI Advanced Technologies & Accessories
-
MPI Advanced Semiconductor Test
MPI become very fast the truly innovation leader in the Advanced Semiconductor Tests market. By offering wide range of system’s accessories and unique advanced technologies, such as Automated Test over Multiple Temperatures ATMT™, NoiseShield™, PHC™, VCE™, mDrive™, MPI is offering variety of complete test solutions at highest value.
-
Product
Semiconductor Testing Equipment
-
We provide you with various inspection equipment mainly for the semiconductor post-production process. Also, "inspection boards", "measurement control" and "test applications" are available for you to meet your various needs.
-
Product
Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
-
The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
-
Product
2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD -
-
e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
-
Product
2-Slot BRIC, 256x4, 1Pole, PXI Matrix (2 Sub-cards)
40-559-201-256x4
Matrix Switch Module
This range of BRIC ultra-high-density large PXI matrices are available in 2, 4 or 8-slot PXI sizes to suit all high-performance matrix requirements and are constructed using Pickering Electronics' 4mm x 4mm instrumentation quality reed relays. With their high level of switching density, these PXI matrices allow a complete Functional ATE system to be housed in a single 3U PXI chassis and allow the use of much lower cost 8 or 14-slot chassis. The 40-559 matrices can be used in many industries; typical applications include automotive ECU and semiconductor package testing. Dual analog busing for the narrower matrix options, enable completely separate matrices within a single module for parallel testing.
-
Product
Deskew Calibration Source for CP030, CP030A, CP031, CP031A, AP015, CP150, CP500
DCS025
-
The DCS025 Deskew Calibration Source generates time-aligned voltage and current pulses for precise deskew of voltage and current probes.This is critical for measurements in which small propagation delay differences between probes can have a large impact on a calculated measurement, e.g., instantaneous power semiconductor device loss measurements.
-
Product
Automated Monitoring of Airborne Molecular Contamination
AMC-Monitor T-1000
-
The all-in-one analyzer for FOUP, fab and clean-room environment AMC monitoring in the semiconductor industry. The AMC-Monitor is a modular and flexible platform for airborne molecular contaminations (AMC) monitoring in semiconductor applications such as: FOUP analysis with a focus on VOC and condensables incl. full integration with Pfeiffer Vacuum APA 302 pod analyzer. Clean-room monitoring in fabrication plants.
-
Product
LXI High Voltage Matrix 2-Pole 100x2
60-310-102
Matrix Switch Module
The 60-310 is a 2-pole Matrix Module available in 300x2, 200x2 and 100x2 formats. It is capable of cold switching 1000VDC and has a maximum carry current of 1A. It is designed for high voltage applications including circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing. The 60-310 is designed in accordance with the LXI Standard 1.4 and is supplied in a 2U high, full rack width case with 500mm depth.
-
Product
Linear Electron Accelerators Where Electrons Reach Energy Of Up To 10 MegaWatt
-
*Processing polymer materials and modifying their parameters*Processing semiconductor materials and devices*For treating food products for disinfection, eliminated bugs, pathogens, and micro-organisms, and increasing their shelf life*Processing diamonds, precious stones and semi-precious stones to change their color
-
Product
Software Development Projects
-
Precision Development Consulting Inc
Automation of new process tool prototype in startup environment, Complex R&D Gasbox Automation, Semiconductor System Control Software, Wafer Transfer Control Software, 300mm Factory Automation, Complete port of Spectrometer software to windows, HSMS Protocol
-
Product
SmartPower® Microwave Power Generators
AX2500
-
SmartPower® AX2500 Series intelligent microwave power generators build on ASTeX's experience in producing rugged, reliable microwave power generators for demanding semiconductor fabrication and industrial applications. The AX2500 design architecture incorporates the best of ASTeX field-proven technology, and combines new design features aimed at improved performance and lower cost of ownership.
-
Product
Ultra Clean, High Concentration, High Flow Ozone Generator
SEMOZON® AX8415
-
The SEMOZON® AX8415 is the most innovative and versatile ozone generator developed by MKS. Ultra clean, high concentration, high flow ozone is produced by this generator's novel architecture and patented cell design, converting oxygen to >400 g/Nm3 of high concentration ozone for leading-edge applications in the semiconductor, flat panel display and photovoltaic industries.
-
Product
Device Interface
Interface
Providing flexible, dependable services for device interface design, development, ordering, production, and support. The importance of the device interface has greatly increased, as high speed, high density semiconductor devices are more rapidly developed, and as customers more severely demand high accuracy, high reliability, and high productivity of testing.
-
Product
PROBE CARD
-
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
-
Product
High Current SMU 600/1200/2400 A
AXC85xx
-
Generate extremely short, fully regulated current pulses in 4 ranges. At the same time, carry out measurements directly on the DUT with the integrated VMU and CMU. Perfect for rapid semiconductor tests during production.
-
Product
PXI-2535, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-35
Matrix Switch Module
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2535 is a high-density 4x136 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring field-effect transistor (FET) relays, the PXI‑2535 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
-
Product
Amplifiers
-
We have designed and manufactured amplifiers using all major semiconductor materials, LDMOS, GaN, GaAs, and InP, to produce narrow, wideband, and pulse, receive and transmit amplifiers from 1 MHz to 220 GHz and power levels from mW to over 10 kW.
-
Product
Elemental Analyzers for Carbon, Sulfur, Oxygen, Nitrogen and Hydrogen
-
HORIBA Scientific provides inorganic elemental analyzers for a wide range of applications based on the inert gas fusion technique and high frequency heating combustion in oxygen stream.The EMIA Series for Carbon and Sulfur analysis and EMGA Series for oxygen, nitrogen and hydrogen analysis strongly rely on HORIBA’s experience as a pioneer in Non-Dispersive Infrared (NDIR) technology. Both EMIA and EMGA designs meet all requirements for the metallurgical industry. These instruments also help scientists working in other application fields such as semiconductor, battery materials, ceramics and more.
-
Product
Semiconductor Package Inspection System
-
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
-
Product
Millimeter-Wave Automated Accelerated Reliability Test Systems
nm-Wave AARTS System
-
AARTS fully integrated, automated, turnkey system provides flexibility and accuracy in determining RF and DC performance degradation with aging to predict life expectancy for compound semiconductor devices. Our millimeter-wave Automated Accelerated Reliability Test Systems (AARTS) and fixture solutions are available in standard frequency ranges from 26.5 to 67 GHz.
-
Product
64-Axis PCIe EtherCAT MainDevice Motion Controller
PCIe-8338
Motion Controller
ADLINK PCIe-8338 is a hardware-based EtherCAT motion controller able to support up to 64 synchronized axes and over 10,000 points simultaneously. The PCIe-8338 features dedicated isolated emergency stop input (EMG), and configurable isolated high-speed digital input as not only generic sensor input but also pulsar input, with up to 1MHz input frequency. Optimum jitter control is provided in minimal cycles of 250µs to optimize synchronous I/O performance for vertical automation applications in semiconductor, electronic manufacturing, and others. The PCIe-8338 provides an out-of-shell application-ready (APS) function library to generate multi-dimensional, highly synchronized, time-deterministic event-triggered motion & I/O control. A wide range of compatible 3rd party SubDevice are easily designed with ADLINK's APS function library. ADLINK's MotionCreatorPro 2 utility is fully compliant with the Microsoft Windows environment, that allows complete EtherCAT motion and I/O configuration and function evaluation as well as compiling program download functions.
-
Product
Bonding
-
With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
-
Product
Mixed Signal Test Systems
MTS1010i
-
The MTS-1010i is a more economical version of the MTS-2010i & MTS-1020i testers. It has a reduced platform size and reduced power supplies. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
-
Product
Probe Cards
-
Probe cards are the key in measuring reliability in the ever-evolving testing of semiconductor integrated circuits, which are becoming faster, more compact, and more efficient. We provide a variety of probe cards tailored to customer needs and test environments, always at the highest level of quality.
-
Product
Static Control Devices
-
Panasonic Industrial Devices Sales Company of America
There are many production processes where electrostatic charges disturb smooth operation. To eliminate static, Ionizers are used.Whether the application is for the Semiconductor industry where the components are extremely sensitive and can even be damaged by high electric static charges or for the packaging industry, where plastic sleeves or foils tend to stick to each other, Panasonic has a solution to neutralize electrostatic charge.
-
Product
TDR System
TS9001
-
The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
