Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Automation Monitor
The Automation Monitor is a diagnostic system for remote analysis and troubleshooting of semiconductor capital equipment. The monitor is capable of delivering synchronous streams from strategically located video cameras, sound devices and data sources on the equipment.
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Compact Semiconductor ATE
QST286
Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Kelvin Contact Spring Probes
We have spring probes for Kelvin contact, which best suits to use for sensitive and extremely precise test. It is used by contacting to one terminal of semiconductor by two probes. We have 0.3, 0.4 and 0.5mm pitch probe for Kelvin contact.
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Lan Digitizer / Oszilloscope With 16 Bit, 4 Channels 200 MS/s Up To 8 GS Memory
Razor-X
The GaGe series of Faceless Connected Instruments (FCiX) provide test and measurement professionals new options for integrating high resolution, multi-channel digitizers into Ethernet and LAN enabled measurement systems. The applications served include manufacturing test, automotive test, remote communications monitoring, multi-site semiconductor test, and other solutions where a lightweight but powerful, multi-channel, independent digitizer system is required.
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Metrology
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Industrial Automation
Panasonic Industrial Devices Sales Company of America
Panasonic offers a diverse portfolio of products and over 40 years of design expertise to provide integrated solutions that fits into various automation markets such as Automotive, Semiconductor, Packaging and Bio Medical. Boasting a strong reputation for quality, an established organization of highly experienced professionals and technically advanced products, Panasonic strives to be your trusted partner.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD
e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
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Semiconductor Package Wind Tunnel
WT-100
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Transmission Line Pulse Testing
Transmission Line Pulse testing, or TLP testing, is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the pin under test (PUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP).
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Advanced Packaging & TSV
FilmTek 2000M TSV
Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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LV Iron Core Line & Load Reactors
Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Metrology System
Echo
The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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Fully Automatic 4 Point Probe Sheet Resistance System For Semiconductor Process Evaluate
WS-3000
*Automatic probe head selection(exchanger) among 4 kinds of probe head*[No need to exchange a probe head by each different sample measurement]*Edge 1mm measurement is available by dual meas. mode*High cost performance from high speed measurement*FOUP compatible, GEM / SECS compatible
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Semiconductor
Scientific Computing International
Materials which have a conductivity between conductors (generally metals) and nonconductors or insulators
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Semiconductor Test Platform
PAx
PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
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Surface Photovoltage
The surface photovoltage spectroscopy modules are the perfect all-in-one solution for in-depth studies of light sensitive materials such as organic semiconductors, solar cells or light sensitive dyes.
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Analytical Probe Station with Laser Cutting System
LCS- 4000 Series
The LCS-4000 Probe Station with Integrated Laser Cutting System gives the user maximum flexibility in semiconductor diagnostic cutting, failure analysis, trimming, marking and topside layer removal. All of these functions can be performed on a microscopic level, all on this one system which provides a high level of performance that is remarkably easy to use.
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300 Mm Semiconductor Processes
With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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Piezo-resistive Accelerometer
A Piezo-resistive Accelerometer has a stable structure composed on a silicon chip created by the micromachining and semiconductor production technology. A mass and a beam on which a set of the Piezo-resisters are created on the silicon chip. A set of electrical bridged is formed by such Piezo-resistive resisters to generate signals proportional to the applied acceleration.
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Nano-focus X-ray Inspection System
X-eye NF120
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Low Noise Amplifiers
RPG Low Noise Amplifiers are developed and manufactured using the most modern discrete components and thin film technologies, in order to cover the frequency range 50 to 350 GHz. With improved DC-supply and modern semiconductors these amplifiers not only deliver low noise performance but also broad operating bandwidth and gain flatness. These low-noise amplifiers are available as a standard product and on request as customized manufactured product.
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Analytical Software for Microscopy
SPIP
SPIP™ or Scanning Probe Image Processor - is an advanced software package for processing and analyzing microscopic images at nano- and microscale. It has been developed as a proprietary software by Image Metrology and is unique in the microscopy and microscale research market. With the high level of usable features, SPIP provides industrial and academic researchers with an advanced toolkit for working with microscope images, incl. extracting data from most microscopy file types, cleaning and enhancing data, analyzing measurements, visualizing and reporting analysis results. The software is used for research and innovation in a variety of industries such as pharmaceutical, cosmetics, semiconductors, hard disk manufacturing, polymer and aluminum manufacturing. Furthermore, SPIP is widely recognized as the standard microscope image analysis software for research and education at leading universities, and has been cited in more than 1200 scientific publications.
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Highest Throughput For Fragile Devices
Ismeca NY20
20-position turret platform for semiconductor test, inspection and packaging, provides the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity.
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Fully Integrated Modular Ozone Delivery System
SEMOZON® AX8580
The SEMOZON® AX8580 Ozone Delivery System generates and delivers high flow, high concentration, ultra-clean ozone for advanced thin film applications. The SEMOZON AX8580 is specifically designed for use with an increasing number of semiconductor process applications such as ALD, CVD and TEOS/Ozone CVD.
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Rad Hard GaN Drivers
The space market has been driving towards more efficient power management solutions. Part of the drive includes the use of Gallium Nitride Field Effect Transistors (GaN FETs) for power conversion. GaN FETs have higher power conversion efficiency and have more natural immunity to radiation, due to them being wide-bandgap semiconductors. Equally important is the use of the correct driver that will allow reliable operation and maximize the benefits of the GaN FETs. Some of the key driver requirements are: a well-regulated gate drive voltage; high source/sink current capability and a split driver output stage.
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Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
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3.4 MP Autofocus (Liquid Lens) Low Light Camera Module
e-CAM31_MI0330_MOD
e-CAM31_MI0330_MOD is a high performance, small form factor, 3.4 MP Autofocus Low Light Camera Module with Liquid Lens. It is based on AR0330 CMOS Image sensor from ON Semiconductor®. This Autofocus Liquid Lens Camera Module has slave mode for precise frame-rate control and for synchronizing two sensors. e-CAM31_MI0330_MOD – Liquid lens camera module has superior low light performance. It supports Full HD @ 60fps for maximum video performance. It also has a support for external mechanical shutter and an on-chip phase-locked loop (PLL) oscillator. The dedicated ISP performs the entire Auto functions like auto white balance, auto exposure control in addition to complete image signal processing pipeline.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
